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Specialty Chemicals Update Program

Electronic Chemicals: PCB Chemicals and Semiconductor Packaging Materials

Table of Contents

Section Page Number

Abbreviations9
Executive summary10
Summary11
North America16
Western Europe16
Japan16
China16
South Korea17
Taiwan17
Other Asia17
Introduction18
Overview of the PCB industry and the semiconductor packaging industry19
PCB industry19
PCB markets20
Semiconductor packaging industry21
Semiconductor packaging markets22
United States23
Industry structure23
Industry market trends23
Western Europe25
Industry structure25
Industry market trends26
Japan27
Industry structure27
Industry market trends28
China28
Industry structure28
Industry market trends29
South Korea30
Industry structure30
Industry market trends31
Taiwan31
Industry structure31
Industry market trends31
Other Asia32
ASEAN countries32
Industry structure32
Industry market trends32
Overview of the PCB and semiconductor packaging chemicals industry34
Market size and growth34
United States34
Western Europe34
Japan35
China36
South Korea37
Taiwan38
Other Asia39
Structure of the industry40
United States40
Western Europe42
Japan44
China44
Company profiles44
The Dow Chemical Company45
DuPont46
Rogers Corporation48
Hitachi Chemical Co., Ltd.50
Sumitomo Bakelite Co., Ltd.51
Operating characteristics53
Research and development53
Manufacturing54
Marketing and technical service54
Cost structure and profitability55
Government regulations56
United States57
Western Europe57
Rohs/Weee directives57
REACH Directive58
Japan59
China59
Other Asia60
Trends and opportunities60
Technology60
Business61
Critical factors for success62
Product types and markets64
Products and functions64
PCB chemicals and materials64
PCB substrates and materials65
PCB resists65
PCB etchants66
PCB plating chemicals66
Thick film pastes and solder pastes67
Semiconductor packaging materials69
Substrates69
Encapsulants70
Die-attach materials70
Other71
Technology and manufacturing72
PCB chemicals and materials72
PCB substrates and materials72
PCB resists73
PCB etchants73
PCB plating chemicals74
Thick film pastes75
Semiconductor packaging materials75
Substrates or interposers75
Encapsulants76
Die-attach materials76
Markets by region78
United States78
PCB chemicals and materials78
PCB substrates78
Consumption and markets78
Market participants80
Prices82
Future trends and strategic issues82
PCB resists82
Consumption and markets82
Market participants83
Prices84
Future trends and strategic issues84
PCB etchants84
Consumption and markets84
Market participants85
Prices85
Future trends and strategic issues85
PCB plating chemicals86
Consumption and markets86
Market participants87
Prices88
Future trends and strategic issues88
Thick film pastes88
Consumption and markets88
Market participants89
Prices91
Future trends and strategic issues91
Semiconductor packaging materials92
Substrates93
Consumption and markets93
Market participants93
Future trends and strategic issues94
Encapsulants94
Consumption and markets94
Market participants94
Prices95
Future trends and strategic issues95
Die-attach materials96
Consumption and markets96
Market participants96
Future trends and strategic issues96
Other97
Western Europe97
PCB chemicals and materials97
PCB substrates and materials98
Consumption and markets98
Market participants98
Prices 99
Future trends and strategic issues 99
PCB resists 100
Consumption and markets 100
Market participants 101
Prices 102
Future trends and strategic issues 103
PCB etchants 103
Consumption and markets 103
Market participants 103
Prices 104
Future trends and strategic issues 104
PCB plating chemicals 104
Consumption and markets 104
Market participants 105
Prices 105
Future trends and strategic issues 106
Thick film pastes 106
Consumption and markets 106
Market participants 107
Prices 107
Future trends and strategic issues 107
Semiconductor packaging materials 107
Substrates 109
Consumption and markets 109
Prices 109
Encapsulants 109
Consumption and markets 109
Market participants 109
Prices 109
Future trends and strategic issues 110
Die-attach materials 110
Consumption and markets 110
Market participants 110
Prices 110
Future trends and strategic issues 110
Japan 111
PCB chemicals and materials 111
PCB substrates and materials 111
Consumption and markets 111
Market participants 113
Prices 115
Future trends and strategic issues 115
PCB resists 116
Consumption and markets 116
Market participants 117
Prices 118
Future trends and strategic issues 118
PCB etchants 118
Consumption and markets 118
Market participants 119
Prices 120
Future trends and strategic issues 120
PCB plating chemicals 120
Consumption and markets 120
Market participants 121
Prices 122
Future trends and strategic issues 122
Thick film pastes 122
Consumption and markets 122
Market participants 123
Prices 124
Future trends and strategic issues 124
Semiconductor packaging materials 124
Substrates 124
Consumption and markets 124
Market participants 125
Prices 126
Future trends and strategic issues 126
Encapsulants 126
Consumption and markets 126
Market participants 127
Prices 127
Future trends and strategic issues 127
Die-attach materials 128
Consumption and markets 128
Market participants 128
Prices 129
Future trends and strategic issues 129
Other 129
China 129
PCB chemicals and materials 129
PCB substrates and materials 129
Consumption and markets 129
Market participants 131
Prices 133
Future trends and strategic issues 133
PCB resists 133
Consumption and markets 133
Market participants 134
Prices 134
PCB etchants 134
Consumption and markets 134
Market participants 135
Future trends and strategic issues 135
PCB plating chemicals 135
Consumption and markets 135
Market participants 135
Future trends and strategies 136
Thick film pastes 136
Market and consumption 136
Market participants 136
Price 136
Semiconductor packaging materials 137
Substrates 137
Consumption and markets 137
Market participants 137
Encapsulants 138
Consumption and markets 138
Market participants 139
Prices 140
Future trends and strategic issues 140
Die-attach materials 140
Other 140
South Korea 141
PCB chemicals and materials 141
PCB substrates and materials 141
Consumption and markets 141
Market participants 141
Future trends and strategic issues 142
PCB resists 142
Consumption and markets 142
Market participants 143
Prices 143
Future trends and strategic issues 143
PCB etchants 144
Consumption and markets 144
Market participants 144
Prices 144
Future trends and strategic issues 144
PCB plating chemicals 145
Consumption and markets 145
Market participants 145
Prices 146
Future trends and strategic issues 146
Thick film pastes 146
Consumption and markets 146
Market participants 147
Prices 147
Future trends and strategic issues 147
Semiconductor packaging materials 147
Substrates 147
Consumption and markets 147
Market participants 148
Prices 148
Future trends and strategic issues 148
Encapsulants 148
Consumption and markets 148
Market participants 148
Prices 149
Future trends and strategic issues 149
Die-attach materials 149
Consumption and markets 149
Market participants 149
Prices 150
Future trends and strategic issues 150
Other 150
Taiwan 150
PCB chemicals and materials 150
PCB Substrates and materials 150
Consumption and markets 150
Market participants 151
Future trends and strategic issues 152
PCB resists 152
Consumption and markets 152
Market participants 152
Prices 153
Future trends and strategic issues 153
PCB etchants 153
Consumption and markets 153
Market participants 154
Prices 154
Future trends and strategic issues 154
PCB plating chemicals 154
Consumption and markets 154
Market participants 155
Prices 155
Future trends and strategic issues 156
Thick film pastes 156
Consumption and markets 156
Market participants 156
Prices 157
Future trends and strategic issues 157
Semiconductor packaging materials 157
Substrates 157
Consumption and markets 157
Market participants 157
Prices 157
Future trends and strategic issues 158
Encapsulants 158
Consumption and markets 158
Market participants 158
Prices 159
Future trends and strategic issues 159
Die-attach materials 159
Consumption and markets 159
Market participants 159
Prices 159
Future trends and strategic issues 160
Other 160
Other Asia (ASEAN countries and India) 160
PCB chemicals and materials 160
Consumption and markets 160
Market participants 161
Future trends and strategic issues 162
Semiconductor packaging materials 162
Consumption and markets 162
Market participants 163
Future trends and strategic issues 164

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