IEC - Microelectronics Collection
This collection contains documents from the following standards organization(s): International Electrotechnical Commission
| IEC 60748-2-9 | EN-Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits - Section 9: Blank Detail Specification for MOS Ultraviolet Light Erasable Electrically Programmable Read-Only Memories-Edition 1; IEC | |
| IEC 60748-20 | EN-Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits-First Edition; Amendment 1: 9/1995 | |
| IEC 60748-20-1 | EN-Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Section 1: Requirements for Internal Visual Examination-First Edition | |
| IEC 60748-21 | EN-Semiconductor Devices - Integrated Circuits - Part 21: Sectional Specification for Film Integrated Circuits and Hybrid Film Intergrated Circuits on the Basis of Qualification Approval Procedures-Second Edition; IECQ | |
| IEC 60748-21-1 | EN-Semiconductor Devices - Integrated Circuits - Part 21-1: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of Qualification Approval Procedures-Second Edition; I | |
| IEC 60748-22 | EN-Semiconductor Devices - Integrated Circuits - Part 22: Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures-Second Edition; IECQ | |
| IEC 60748-22-1 | EN-Semiconductor Devices - Integrated Circuits - Part 22-1: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures-Edition 2.0 | |
| IEC 60748-23-1 | EN-Semiconductor Devices - Integrated Circuits - Part 23-1: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Generic Specification-First Edition | |
| IEC 60748-23-2 | EN-Semiconductor Devices - Integrated Circuits - Part 23-2: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Internal Visual Inspection and Special Tests-First Edition; IECQ QC 165000- | |
| IEC 60748-23-3 | EN-Semiconductor Devices - Integrated Circuits - Part 23-3: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Manufacturers´ Self-Audit Checklist and Report-First Edition | |
| IEC 60748-23-4 | EN-Semiconductor Devices - Integrated Circuits - Part 23-4: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Blank Detail Specification-First Edition | |
| IEC 60748-23-5 | EN-Semiconductor devices Integrated circuits Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval-First Edition; QC 165000-5 | |
| IEC 60748-3 | EN-Semiconductor Devices Integrated Circuits Part 3: Analogue Integrated Circuits-Edition 1; Amendment 1: 1991; Amendment 2: 1994; Corrigendum: 06/1996 | |
| IEC 60748-3-1 | EN-Semiconductor Devices Integrated Circuits Part 3: Analogue Integrated Circuits Section One - Blank Detail Specification for Monolithic Integrated Operational Amplifiers-First Edition; Same as IECQ QC 790202 | |
| IEC 60748-4 | EN-Semiconductor Devices - Integrated Circuits - Part 4: Interface Integrated Circuits-Second Edition; IECQ QC 790300 | |
| IEC 60748-4-1 | EN-Semicondutor Devices - Integrated Circuits - Part 4: Interface Integrated Circuits - Section 1: Blank Detail Specification for Linear Digital-to-Analogue Converters (DAC)-First Edition; IECQ QC 790303 | |
| IEC 60748-4-2 | EN-Semiconductor Devices - Integrated Circuits - Part 4: Interface Integrated Circuits - Section 2: Blank Detail Specification for Linear Analogue-to-Digital Converters (ADC)-First Edition; Same AS IECQ QC 790304 | |
| IEC 60748-4-3 | EN-Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)-Edition 1 | |
| IEC 60748-5 | EN-Semiconductor Devices - Integrated Circuits - Part 5: Semicustom Integrated Circuits-First Edition | |
| IEC 60749-1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 1: General-First Edition | |
| IEC 60749-1 CORR 1 | EN-SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 1: General CORRIGENDUM 1-First Edition | |
| IEC 60749-10 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock-First Edition | |
| IEC 60749-10 CORR 1 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1-First Edition | |
| IEC 60749-11 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 11: Rapid Change of Temperature - Two-Fluid-Bath Method-First Edition | |
| IEC 60749-11 CORR 1 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 11: Rapid Change of Temperature - Two-Fluid-Bath Method CORRIGENDUM 1-First Edition | |
| IEC 60749-11 CORR 2 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 11: Rapid Change of Temperature - Two-Fluid-Bath Method CORRIGENDUM 2-First Edition | |
| IEC 60749-12 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 12: Vibration Variable Frequency-First Edition | |
| IEC 60749-12 CORR 1 | EN-SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 12: Vibration variable frequency CORRIGENDUM 1-First Edition | |
| IEC 60749-13 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 13: Salt Atmosphere-First Edition | |
| IEC 60749-13 CORR 1 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 13: Salt Atmosphere CORRIGENDUM 1-First Edition | |
| IEC 60749-14 | EN-Semiconductor devices Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity)-First Edition; Together with IEC 60749-31:2002 IEC 60749-3:2002 And IEC 60749-15:2003 Replaces IEC | |
| IEC 60749-15 | EN-Semiconductor devices Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices-First Edition; Replaces IEC/PAS 62174: 2000; Together with IEC 60749-14:200 | |
| IEC 60749-16 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 16: Particle Impact Noise Detection (PIND)-First Edition; Replaces IEC/PAS 62171 | |
| IEC 60749-17 | EN-Semiconductor devices Mechanical and climatic test methods Part 17: Neutron irradiation-First Edition | |
| IEC 60749-18 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)-First Edition | |
| IEC 60749-19 | EN-Semiconductor devices Mechanical and climatic test methods Part 19: Die shear strength-Edition 1.0 | |
| IEC 60749-19 AMD 1 | EN-AMENDMENT 1 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength-Edition 1.0 | |
| IEC 60749-2 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 2: Low Air Pressure-First Edition | |
| IEC 60749-2 CORR 1 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 2: Low Air Pressure CORRIGENDUM 1-First Edition | |
| IEC 60749-20 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat-Edition 2.0 | |
| IEC 60749-20-1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling packing labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat-Edition | |
| IEC 60749-21 | EN-Semiconductor devices Mechanical and climatic test methods Part 21: Solderability-Edition 1 | |
| IEC 60749-22 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength-First Edition | |
| IEC 60749-22 CORR 1 | EN-SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 22: Bond strength CORRIGENDUM 1-First Edition | |
| IEC 60749-23 | EN-Semiconductor devices Mechanical and climatic test methods Part 23: High temperature operating life-First Edition; Replaces IEC PAS 62189:2000 | |
| IEC 60749-24 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST-First Edition; Replaces IEC PAS 62336:2002 | |
| IEC 60749-25 | EN-Semiconductor devices Mechanical and climatic test methods Part 25: Temperature cycling-First Edition | |
| IEC 60749-26 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)-Edition 2.0 | |
| IEC 60749-27 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)-Edition 2.0 | |
| IEC 60749-29 | EN-Semiconductor devices Mechanical and climatic test methods Part 29:Latch-up test-First Edition; Replaces IEC PAS 62181 | |
| IEC 60749-3 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 3: External Visual Examination-First Edition | |
| IEC 60749-3 CORR 1 | EN-SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 3: External visual examination CORRIGENDUM 1-First Edition | |
| IEC 60749-30 | EN-Semiconductor devices Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing-First Edition; Replaces IEC PAS 62182: 2000 | |
| IEC 60749-31 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)-First Edition | |
| IEC 60749-31 CORR 1 | EN-SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 31: Flammability of plastic-encapsulated devices (internally induced) CORRIGENDUM 1-First Edition | |
| IEC 60749-32 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)-Edition 1.0 | |
| IEC 60749-32 AMD 1 | EN-AMENDMENT 1 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)-Edition 1.0 | |
| IEC 60749-32 CORR 1 | EN-SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 32: Flammability of plastic-encapsulated devices (externally induced) CORRIGENDUM 1-Edition 1.0 | |
| IEC 60749-33 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave-First Edition; Replaces IEC PAS 62172:2000 | |
| IEC 60749-34 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling-First Edition; Replaces IEC PAS 62206:2000 | |
| IEC 60749-35 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components-Edition 1.0 | |
| IEC 60749-36 | EN-Semiconductor devices Mechanical and climatic test methods Part 36: Acceleration steady state-First Edition | |
| IEC 60749-37 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer-Edition 1.0 | |
| IEC 60749-38 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory-Edition 1.0 | |
| IEC 60749-39 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components-Edition 1; Supersedes IEC/PA | |
| IEC 60749-4 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat steady state highly accelerated stress test (HAST)-First Edition | |
| IEC 60749-4 CORR 1 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat Steady State Highly Accelerated Stress Test (HAST) CORRIGENDUM 1-First Edition | |
| IEC 60749-5 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test-First Edition; Replaces IEC/PAS 62161 | |
| IEC 60749-6 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 6: Storage at High Temperature-First Edition | |
| IEC 60749-6 CORR 1 | EN-SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 6: Storage at high temperature CORRIGENDUM 1-First Edition | |
| IEC 60749-7 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 7: Internal Moisture Content Measurement and the Analysis of Other Residual Gases-First Edition | |
| IEC 60749-7 CORR 1 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 7: Internal Moisture Content Measurement and the Analysis of Other Residual Gases CORRIGENDUM 1-First Edition | |
| IEC 60749-8 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing-First Edition | |
| IEC 60749-8 CORR 1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing CORRIGENDUM 1-First Edition | |
| IEC 60749-8 CORR 2 | EN-SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - Part 8: Sealing CORRIGENDUM 2-First Edition | |
| IEC 60749-9 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking-First Edition | |
| IEC 60749-9 CORR 1 | EN-Semiconductor Devices - Mechanical and Climatic Test Methods - Part 9: Permanence of Marking CORRIGENDUM 1-First Edition | |
| IEC 60758 | EN-Synthetic quartz crystal - Specifications and guidelines for use-Edition 4.0 | |
| IEC 60760 | EN-Flat Quick-Connect Terminations Second Edition; (Amendment 1-1993)-Bilingual; Amendment 1: 08/1993 |