DS - Electronics Collection
This collection contains documents from the following standards organization(s): Dansk Standard
| DANSK DS/EN 60749-14 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) | |
| DANSK DS/EN 60749-15 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices | |
| DANSK DS/EN 60749-16 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noice detection (PIND) | |
| DANSK DS/EN 60749-17 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation | |
| DANSK DS/EN 60749-18 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) | |
| DANSK DS/EN 60749-19 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength | |
| DANSK DS/EN 60749-2 | EN-Semiconductor Devices - Mechanical and climatic test methods - Part 2: Low air pressure | |
| DANSK DS/EN 60749-2/Corr.1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure | |
| DANSK DS/EN 60749-20 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat | |
| DANSK DS/EN 60749-20-1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling packing labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat | |
| DANSK DS/EN 60749-21 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability | |
| DANSK DS/EN 60749-22+Corr.1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strenght | |
| DANSK DS/EN 60749-23 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life | |
| DANSK DS/EN 60749-24 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST | |
| DANSK DS/EN 60749-25 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling | |
| DANSK DS/EN 60749-26 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) | |
| DANSK DS/EN 60749-27 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) | |
| DANSK DS/EN 60749-29 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test | |
| DANSK DS/EN 60749-3 | EN-Semiconductor devices - Mechanical and climatic test method - Part 3: External visual examination | |
| DANSK DS/EN 60749-3/Corr.1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination | |
| DANSK DS/EN 60749-30 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing | |
| DANSK DS/EN 60749-31+Corr.1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) | |
| DANSK DS/EN 60749-32+Corr.1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) | |
| DANSK DS/EN 60749-33 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave | |
| DANSK DS/EN 60749-34 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling | |
| DANSK DS/EN 60749-35 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components | |
| DANSK DS/EN 60749-36 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration steady state | |
| DANSK DS/EN 60749-37 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer | |
| DANSK DS/EN 60749-38 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory | |
| DANSK DS/EN 60749-39 | EN-Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components | |
| DANSK DS/EN 60749-4 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat steady state highly accelerated stress test (HAST) | |
| DANSK DS/EN 60749-4/Corr.1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat steady state highly accelerated stress test (HAST) | |
| DANSK DS/EN 60749-5 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | |
| DANSK DS/EN 60749-6 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature | |
| DANSK DS/EN 60749-6/Corr.1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature | |
| DANSK DS/EN 60749-7 | EN-Semiconductor devices - Mechanical and climatic test method - Part 7: Internal moisture content measurement and the analysis of other residual gases | |
| DANSK DS/EN 60749-7/Corr.1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases | |
| DANSK DS/EN 60749-8+Corr.2 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing | |
| DANSK DS/EN 60749-9 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking | |
| DANSK DS/EN 60749-9/Corr.1 | EN-Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking | |
| DANSK DS/EN 60758 | EN-Synthetic quartz crystal - Specifications and guidelines for use | |
| DANSK DS/EN 60825-1 | EN-Safety of laser products. Part 1: Equipment classification requirements and user's guide | |
| DANSK DS/EN 60825-1 | EN-Safety of laser products - Part 1: Equipment classification and requirements | |
| DANSK DS/EN 60825-1/A1 | EN-Safety of laser products - Part 1: Equipment classification requirements and user's guide | |
| DANSK DS/EN 60825-1/A11+Corr. | EN-Safety of laser products - Part 1: Equipment classification requirements and user's guide | |
| DANSK DS/EN 60825-1/A2 | EN-Safety of laser products - Part 1: Equipment classification requirements and user's guide | |
| DANSK DS/EN 60825-1/A2/Corr. | EN-Safety of laser products - Part 1: Equipment classification requirements and user's guide | |
| DANSK DS/EN 60825-1/A2/Corr.1 | EN-Safety of laser products - Part 1: Equipment classification requirements and user's guide | |
| DANSK DS/EN 60825-12 | EN-Safety of laser products - Part 12: Safety of free space optical communication systems used for transmission of information | |
| DANSK DS/EN 60825-2 | EN-Safety of laser products - Part 2: Safety of optical fibre communication systems (OFCS) | |
| DANSK DS/EN 60825-2/A1 | EN-Safety of laser products - Part 2: Safety of optical fibre communication systems (OFCS) | |
| DANSK DS/EN 60825-4 | EN-Safety of laser products - Part 4: Laser guards | |
| DANSK DS/EN 60825-4/A1 | EN-Safety of laser products - Part 4: Laser guards | |
| DANSK DS/EN 60838-2-2 | EN-Miscellaneous lampholders - Part 2-2: Particular requirements - Connectors for LED-modules | |
| DANSK DS/EN 60862-1 | EN-Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification | |
| DANSK DS/EN 60862-2 | EN-Surface acoustic wave (SAW) filters of assessed quality - Part 2: Guidance on use | |
| DANSK DS/EN 60862-3 | EN-Surface acoustic wave (SAW) filters of assessed quality - Part 3: Standard outlines | |
| DANSK DS/EN 60915 | EN-Fixed capacitors and resistors for use in electronic equipment - Preferred dimensions of shaft ends bushes and for the mounting of single-hole bush-mounted shaft-operated electronic components | |
| DANSK DS/EN 60917-1 | EN-Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard | |
| DANSK DS/EN 60917-1/A1 | EN-Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard | |
| DANSK DS/EN 60917-2-1 | EN-Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 1: Detai | |
| DANSK DS/EN 60917-2-2 | EN-Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail | |
| DANSK DS/EN 60917-2-3 | EN-Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detai | |
| DANSK DS/EN 60933-5 | EN-Audio video and audiovisual systems - Interconnections and matching values - Part 5: Y/C connector for video systems - Electrical matching values and description of the connector | |
| DANSK DS/EN 60938-1 | EN-Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification | |
| DANSK DS/EN 60938-1/A1 | EN-Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification | |
| DANSK DS/EN 60938-2 | EN-Fixed inductors for electromagnetic interference suppression - Part 2: Sectional specification | |
| DANSK DS/EN 60938-2-1 | EN-Fixed inductors for electromagnetic interference suppression - Part 2-1: Blank detail specification - Inductors for which safety tests are required - Assessment level D. | |
| DANSK DS/EN 60938-2-2 | EN-Fixed inductors for electromagnetic interference suppression - Part 2-2: Blank detail specification - Inductors for which safety tests are required (only) | |
| DANSK DS/EN 60938-2/A1 | EN-Fixed inductors for electromagnetic interference suppression - Part 2: Sectional specification | |
| DANSK DS/EN 60939-1 | EN-Passive filter units for electromagnetic interference suppression -- Part 1: Generic specification | |
| DANSK DS/EN 60939-2 | EN-Passive filter units for electromagnetic interference suppression -- Part 2: Sectional specification: Passive filter units for which safety tests are appropriate - Test methods and general requirements | |
| DANSK DS/EN 60939-2-1 | EN-Complete filter units for radio interference suppression - Part 2-1: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (asses | |
| DANSK DS/EN 60939-2-2 | EN-Complete filter units for radio interference suppression - Part 2-2: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (safet | |
| DANSK DS/EN 61019-1 | EN-Surface acoustic wave (SAW) resonators - Part 1: Generic specification | |
| DANSK DS/EN 61019-2 | EN-Surface acoustic wave (SAW) resonators -- Part 2: Guide to the use | |
| DANSK DS/EN 61020-1 | EN-Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification | |
| DANSK DS/EN 61051-1 | EN-Varistors for use in electronic equipment - Part 1: Generic specification | |
| DANSK DS/EN 61071 | EN-Capacitors for power electronics |