BSI Special TH Collection
This collection contains documents from the following standards organization(s): British Standards Institution
| BSI BS A 355 | EN-Inserts Self-Locking with MJ Threads Open Type in Metallic Material Coated or Uncoated - Dimensions-ISO 13597: 2000; | |
| BSI BS A 356 | EN-Inserts Self-Locking with MJ Threads Reduced Flanges Closed Type in Metallic Material Coated or Uncoated - Dimensions-ISO 13598: 2000; | |
| BSI BS A 357 | EN-Inserts with Clearance Hole in Metallic Material Coated or Uncoated - Dimensions-ISO 13599: 2000; | |
| BSI BS A 358-1 | EN-MJ Threads - Part 1: General Requirements-Supersedes BS 6293-1:1994; ISO 5855-1:1999; | |
| BSI BS A 358-2 | EN-MJ Threads - Part 2: Limit Dimensions for Bolts and Nuts-Supersedes BS 6293-2:1994; ISO 5855-2:1999; | |
| BSI BS A 358-3 | EN-MJ Threads - Part 3: Limit Dimensions for Fittings for Fluid Systems-Supersedes BS 6293-3:1994; ISO 5855-3:1999; | |
| BSI BS A 359 | EN-Nuts Barrel Self-Locking Floating with MJ Threads Classifications: 900 MPa (at Ambient Temperature)/235 Degrees C 1100 MPa (at Ambient Temperature)/235 Degrees C 1250 MPa (at Ambient Temperature)/235 Degrees C | |
| BSI BS A 360 | EN-Retainers Spring Sheet Metal for Self-Locking Barrel Nuts - Dimensions-ISO 12280:1999; | |
| BSI BS A 361 | EN-Rivets Solid 100 Degree Normal Countersunk Head in Metallic Material with or without Surface Treatment - Dimensions-ISO 12281:1999; | |
| BSI BS A 363 | EN-Bolts with MJ Threads Made of Heat-Resistant Nickel-Based Alloy Strength Class 1 550 MPa - Procurement Specification-ISO 9154: 2000; | |
| BSI BS A 364 | EN-Rivets Solid - Test Method-ISO 17057: 1999; | |
| BSI BS A 55 AND 56 | EN-Grub Screws for Aeronautical Purposes-AMD 1675: July 1953; AMD 3170: September 15 1958 | |
| BSI BS AU 7A | EN-Specification for Colour Code for Road Vehicle Electrical Cables | |
| BSI BS C 10 | EN-Coupling Dimensions for Aircraft Ground Air-Conditioning Connections-AMD 1293: October 31 1973 | |
| BSI BS C 15 | EN-Specification for Coupling Dimensions for Aircraft-To-Tractor Tow Bar Connections-AMD PD 5762: February 18 1966 | |
| BSI BS C 16 | EN-Dimensions for gaseous oxygen replenishment couplings for aircraft | |
| BSI BS C 17 | EN-Specification for Coupling Dimensions for Low Pressure Air Connections for Engine Starting | |
| BSI BS C 20 | EN-Specification for Aircraft Gaseous Oxygen Replenishment Connection (Inch Dimensions) | |
| BSI BS C 22 | EN-Test Methods for Aircraft Inner Tube and Tubeless Tyre Valves - Cores and Caps (ISO 9475: 1994) (S) | |
| BSI BS C 3 | EN-Coupling Dimensions for Aircraft Pressure Re-Oiling Connection | |
| BSI BS C 6 | EN-Specification for Aircraft Engine Nacelle Fire Extinguisher Doors | |
| BSI BS C 9 | EN-Specification for Coupling Dimensions for High Pressure Air Charging Valves for Aircraft | |
| BSI BS CECC 00009 | EN-Harmonized system of quality assessment for electronic components Basic specification: Basic testing procedures and measuring methods for electromechanical components | |
| BSI BS CECC 00016 | EN-Basic Specification: Basic Requirements for the Use of Statistical Process Control (SPC) in the CECC System (T) | |
| BSI BS CECC 00108 | EN-Rule of Procedure 8 Attestation of Conformity the CECC Mark and Conditions of Use Certificates of Approval and Procedures for the Attestation of Conformity | |
| BSI BS CECC 00111-0 | EN-Rule of Procedure 11 Specifications Part 0: an Introduction to the Types of Specifications Applicable Within the CECC System (T) | |
| BSI BS CECC 00804 | EN-Harmonized System of Quality Assessment for Electronic Components Interpretation of 'EN ISO 9000: 1994' Reliability Aspects for Electronic Components (T) | |
| BSI BS CECC 00808 | EN-Harmonized System of Quality Assessment for Electronic Components Guidance Document: Use and Application of Plastic Encapsulated Devices (T) | |
| BSI BS CECC 11000 | EN-Generic Specification: Cathode Ray Tubes (AMD 6004) July 15 1992 (T)-Amd 1; | |
| BSI BS CECC 11001 | EN-Cathode Ray Tubes: Blank Detail Specification | |
| BSI BS CECC 11101 | EN-Specification for Harmonized system of quality assessment for electronic components Blank detail specification | |
| BSI BS CECC 12000 | EN-Generic Specification: Image Converter and Image Intensifier Tubes-AMD 6008: July 15 1992; Renumbered as BS EN 112000:1980 | |
| BSI BS CECC 12001 | EN-Image Converter and Image Intensifier Tubes: Blank Detail Specification-Renumbered as BS EN 112001:1980 | |
| BSI BS CECC 123400-003 | EN-Harmonized System of Quality Assessment for Electronic Components: Capability Detail Specification: Flexible Printed Boards Without Through-Connections-AMD 9198 December 151996; | |
| BSI BS CECC 123500-003 | EN-Harmonized System of Quality Assessment for Electronic Components: Capability Detail Specification: Flexible Printed Boards with Through-Connections-AMD 9208; December 15 1996; | |
| BSI BS CECC 13001 | EN-Camera Tubes: Blank Detail Specification-Renumbered as BS EN 113001:1981 | |
| BSI BS CECC 14001 | EN-Photomultiplier Tubes: Blank Detail Specification-Renumbered as BS EN 114001:1984 | |
| BSI BS CECC 16000-1 | EN-Harmonized system of quality assessment for electronic components: Generic specification: Electromechanical all-or-nothing relays Part 1: General | |
| BSI BS CECC 16000-2 | EN-Electromechanical All-or-Nothing Relays: Generic Specifications Part 2: Generic Data and Methods of Test for Time Delay Relays-Renumbered as BS EN 116000-2:1986 | |
| BSI BS CECC 16100 | EN-Harmonized system of quality assessment for electronic components - Sectional specification: Electromechanical all-or-nothing relays | |
| BSI BS CECC 16101 | EN-Specification for Harmonized system of quality assessment for electronic components - Blank detail specification - Electromechanical all-or-nothing relays - Test schedule 3 | |
| BSI BS CECC 16200 | EN-Sectional Specification: Electromechanical All-or-Nothing Relays-Renumbered as BS EN 116200:1992 | |
| BSI BS CECC 17000 | EN-Generic Specification: Solid State All-or- Nothing Relays. Generic Data and Methods of Test-Renumbered as BS EN 117000:1992 | |
| BSI BS CECC 17001 | EN-Specification for Harmonized system of quality assessment for electronic components - Blank detail specification - Mercury wetted make contact units for general application | |
| BSI BS CECC 20000 | EN-Harmonized system of quality assessment for electronic components: Generic specification: Semiconductor optoelectronic and liquid crystal devices-AMD 4606: October 1984; AMD 5800: February 1989 | |
| BSI BS CECC 20001 | EN-Light Emitting Diodes Light Emitting Diode Arrays Light Emitting Diode Displays Without Internal Logic and Resistor (Doc. Renumbered as BS EN 120001: 1993) | |
| BSI BS CECC 20002 | EN-Infrared Emitting Diodes Infrared Emitting Diode Arrays: Blank Detail Specification | |
| BSI BS CECC 200025 | EN-Harmonized System of Quality Assessment for Electronic Components; Process Assessment Schedule: Printed Board Assembly Facilities | |
| BSI BS CECC 20003 | EN-Phototransistors Photodarlington Transistors Phototransistor Arrays: Blank Detail Specification | |
| BSI BS CECC 20004 | EN-Ambient Rated Photocouplers with Phototransistor Output: Blank Detail Specification | |
| BSI BS CECC 20005 | EN-Photodiodes Photodiode-Arrays (Not Intended for Fibre Optic Applications): Blank Detail Specification | |
| BSI BS CECC 20006 | EN-Pin-Photodiodes for Fibre Optic Applications | |
| BSI BS CECC 20007 | EN-Liquid Crystal Displays Monochrome LCDs Without Electronic Circuit (T) | |
| BSI BS CECC 22000 | EN-Generic Specification: Radio Frequency Coaxial Connectors (Parts I II and III) (T) | |
| BSI BS CECC 22110 | EN-Radio Frequency Coaxial Connectors Series SMA: Sectional Specification | |
| BSI BS CECC 22111 | EN-Specification for Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification Radio Frequency Coaxial Connectors Series SMA | |
| BSI BS CECC 22120 | EN-Sectional Specification: Radio Frequency Coaxial Connectors Series BNC-Supersedes BS CECC 22120: 1981; Renumbered as BS EN 122120: 1996 | |
| BSI BS CECC 22121 | EN-Specification for Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification Radio Frequency Coaxial Connectors Series BNC | |
| BSI BS CECC 23000 | EN-Generic Specification: Printed Boards-Renumbered as BS EN 123000: 1992 | |
| BSI BS CECC 23000 | EN-Harmonized System of Quality Assessment for Electronic Components Generic Specification: Printed Boards-AMD 7145; May 1 1992; Renumbered as BS EN 123000: 1992; | |
| BSI BS CECC 23100 | EN-Sectional Specification: Single and Double Sided Printed Boards with Plain Holes | |
| BSI BS CECC 23100-003 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Single and Double Sided Printed Boards with Plain Holes-AMD 9805; February 1998; | |
| BSI BS CECC 23100-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Single and Double-Sided Printed Boards with Plain Holes-Supersedes BS EN 123100-800: 1992; | |
| BSI BS CECC 23200-003 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Single and Double Sided Printed Boards with Plated Through Holes-AMD 9806; February 1998; | |
| BSI BS CECC 23200-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Single and Double-Sided Printed Boards with Plated Through Holes-Supersedes BS EN 123200-800: 1992; | |
| BSI BS CECC 23300 | EN-Sectional Specification: Multilayer Printed Boards (AMD 7062) July 15 1992-Amd 1; | |
| BSI BS CECC 23300-003 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Multilayer Printed Boards-AMD 9807; February 1998 | |
| BSI BS CECC 23300-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Multi-Layer Printed Boards-Supersedes BS EN 123300-800: 1992; | |
| BSI BS CECC 23500 | EN-Specification for Harmonized System of Quality Assessment for Electronic Components: Sectional Specification: Flexible Printed Boards with Through Connections-AMD 7369; November 15 1992; Renumbered as BS EN 123500: | |
| BSI BS CECC 23600-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Flex-Rigid Multilayer Printed Boards with Through Connections | |
| BSI BS CECC 23700-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Flex-Rigid Double-Sided Printed Boards with Through Connections | |
| BSI BS CECC 23800-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Flexible Multilayer Printed Boards with Through Connections | |
| BSI BS CECC 25300 | EN-Magnetic Oxide Cores for Power Applications: Sectional Specification-Amd 1:September 301982 | |
| BSI BS CECC 25401 | EN-Adjusters with Magnetic Oxide (Ferrite) Cores for Use in Inductors and Tuned Transformers: Blank Detail Specification-Renumbered as BS EN 125401: 1984 | |
| BSI BS CECC 265001 | EN-Harmonized System of Quality Assessment for Electronic Components Technology Approval Schedule: Film and Hybrid Integrated Circuits | |
| BSI BS CECC 299 001 | EN-Technology Approval Schedule - Manufacture of Electrical Connectors-CECC 299 001:1999; | |
| BSI BS CECC 30201 001 | EN-Tantalum Capacitors with Solid Electrolyte Porous Anode Metal Case: Detail Specification: Basic Plus Additional | |
| BSI BS CECC 30202 | EN-Tantalum Capacitors with Non-Solid Electrolyte Porous Anode: Blank Detail Specification-Superseded by BS EN 130202: 1998 | |
| BSI BS CECC 30300 | EN-Sectional Specification: Aluminium Electrolytic Capacitors with Solid and Non-Solid Electrolyte-Superseded by BS EN 130300: 1998 |