BSI - Electronic Components of Assessed Quality Collection
This collection contains documents from the following standards organization(s): British Standards Institution
| BSI BS EN 61076-4-001 | EN-Connectors with Assessed Quality for Use in d.c. Low-Frequency Analogue and in Digital High-Speed Data Applications Part 4: Printed Board Connectors Section 001: Blank Detail Specification-IEC 61076-4-001:1996 | |
| BSI BS EN 61076-4-100 | EN-Connectors for Electronic Equipment - Part 4-100: Printed Board Connectors with Assessed Quality - Detail Specification for Two-Part Connector Modules Having a Grid of 25 mm for Printed Boards and Backplanes-IEC 610 | |
| BSI BS EN 61076-4-101 | EN-Connectors for electronic equipment Part 4-101: Printed board connectors with assessed quality - Detail specification for two-part connector modules having a basic grid of 2 mm for printed boards and backplanes | |
| BSI BS EN 61076-4-102 | EN-Connectors with Assessed Quality for Use in d.c. Low-Frequency Analogue and in Digital High Speed Data Applications Part 4: Printed Board Connectors Section 102: Detail Specification for Two-Part Single-Pole Connec | |
| BSI BS EN 61076-4-103 | EN-Connectors for Use in d.c. Low-Frequency Analogue and Digital High Speed Data Applications - Part 4-103: Printed Board Connectors with Assesed Quality - Detail Specification for Two-Part Connectors with Shielding and | |
| BSI BS EN 61076-4-104 | EN-Connectors for Use in d.c. Low-Frequency Analogue and Digital High-Speed Data Applications - Part 4-104: Printed Board Connectors with Assessed Quality - Detail Specification for Two-Part Modular Connectors Basic Gr | |
| BSI BS EN 61076-4-107 | EN-Connectors for Electronic Equipment - Part 4-107: Printed Board Connectors with Assessed Quality - Detail Specification for Shielded Two-Part Connectors Having a Basic Grid of 2 mm Fixed Part with Solder and Press | |
| BSI BS EN 61076-4-108 | EN-Connectors for electronic equipment - Part 4-108: Printed board connectors with assessed quality - Detail specification for cable-to-board connectors with a modular pitch of 25 mm and integrated shielding functi | |
| BSI BS EN 61076-4-110 | EN-Connectors for Electronic Equipment - Part 4-110: Printed Board Connectors with Assessed Quality - Detail Specification for Latched Cable Connector System Having a Basic Grid of 2 mm Including Full Shielding and La | |
| BSI BS EN 61076-4-111 | EN-Connectors for Electronic Equipment Part 4-111: Printed Board Connectors with Assessed Quality Detail Specification for Two-Part Power Connector Modules for Printed Boards and Backplanes Having Early Mating Featur | |
| BSI BS EN 61076-4-113 | EN-Connectors for electronic equipment Printed board connectors Part 4-113: Detail specification for two-part connectors having 5 rows with a grid of 254 mm for printed boards and backplanes in bus applications | |
| BSI BS EN 61076-5 | EN-Connectors for Use in d.c. Low-Frequency Analogue and Digital High-Speed Data Applications - Part 5: In-Line Sockets with Assessed Quality - Sectional Specification-IEC 61076-5:2001; | |
| BSI BS EN 61076-7 | EN-Connectors for Use in d.c. Low-Frequency Analogue and Digital High Speed Data Applications - Part 7: Cable Outlet Accessories with Assessed Quality Including Qualification and Capability Approval - Sectional Specif | |
| BSI BS EN 61169-24 | EN-Radio-frequency connectors - Part 24: Sectional specification - Radio frequency coaxial connectors with screw coupling typically for use in 75 ohm cable networks (type F) | |
| BSI BS EN 61188-7 | EN-Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction | |
| BSI BS EN 61189-5 | EN-Test methods for electrical materials interconnection structures and assemblies - Part 5: Test methods for printed board assemblies | |
| BSI BS EN 61191-6 | EN-Printed board assemblies Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods | |
| BSI BS EN 61193-1 | EN-Quality Assessment Systems - Part 1: Registration and Analysis of Defects on Printed Board Assemblies-CORR 13939: May 14 2002; IEC 61193-1: 2001; | |
| BSI BS EN 61249-2-35 | EN-Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning | |
| BSI BS EN 61249-2-36 | EN-Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test) coppe | |
| BSI BS EN 61249-2-37 | EN-Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability ( | |
| BSI BS EN 61249-2-38 | EN-Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burn | |
| BSI BS EN 61249-2-41 | EN-Materials for printed boards and other interconnecting structures Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flamma | |
| BSI BS EN 61249-2-42 | EN-Materials for printed boards and other interconnecting structures Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammabili | |
| BSI BS EN 61249-4-14 | EN-Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of d | |
| BSI BS EN 61249-4-15 | EN-Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven | |
| BSI BS EN 61249-4-16 | EN-Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenate | |
| BSI BS EN 61249-4-17 | EN-Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven | |
| BSI BS EN 61760-3 | EN-Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering | |
| BSI BS EN 61811-1 | EN-Electromechanical Non-Specified Time All-Or-Nothing Relays of Assessed Quality - Part 1: Generic Specification-Supersedes BS EN 116000-1: 1996; | |
| BSI BS EN 61811-11 | EN-Electromechanical elementary relays of assessed quality Part 11: Blank detail specification Relays for industrial application | |
| BSI BS EN 61811-50 | EN-Electromechanical All-or-Nothing Relays Part 50: Sectional Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality-Supersedes BS EN 116500: 1996; | |
| BSI BS EN 61811-51 | EN-Electromechanical All-or-Nothing Relays Part 51: Blank Detail Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality Non-Standardized Types and Construction | |
| BSI BS EN 61811-52 | EN-Electromechanical All-or-Nothing Relays Part 52: Blank Detail Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality Two Change-Over Contacts 20 mm x 10 mm Base-Supersedes BS EN 116502: | |
| BSI BS EN 61811-53 | EN-Electromechanical All-or-Nothing Relays Part 53: Blank Detail Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality Two Change-Over Contacts 14 mm x 9 mm Base | |
| BSI BS EN 61811-54 | EN-Electromechanical all-or-nothing relays Part 54: Blank detail specification Electromechanical all-or-nothing telecom relays of assessed quality Two change-over contacts 15 mm x 75 mm base-Supersedes BS EN 116504 | |
| BSI BS EN 61811-55 | EN-Electromechanical All-or-Nothing Relays Part 55: Blank Detail Specification Electromechanical All-or-Nothing Telecom Relays of Assessed Quality Two Change-Over Contacts 11 mm x 75 mm (Max.) Base | |
| BSI BS EN 61966-5 | EN-Multimedia systems and equipment - Colour measurement and management - Part 5: Equipment using plasma display panels | |
| BSI BS EN 61984 | EN-Connectors - Safety requirements and tests | |
| BSI BS EN 61988-2-2 | EN-Plasma display panels Part 2-2: Measuring methods Optoelectrical | |
| BSI BS EN 61988-2-3 | EN-Plasma display panels - Part 2-3: Measuring methods - Image quality: defects and degradation | |
| BSI BS EN 61988-3-2 | EN-Plasma display panels - Part 3-2: Interface - Electrical interface | |
| BSI BS EN 61988-5 | EN-Plasma display panels - Part 5: Generic specification | |
| BSI BS EN 62007-1 | EN-Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics | |
| BSI BS EN 62007-2 | EN-Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods | |
| BSI BS EN 62047-6 | EN-Semiconductor devices - Micro-electromechanical devices Part 6: Axial fatigue testing methods of thin film materials | |
| BSI BS EN 62137-1-3 | EN-Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test | |
| BSI BS EN 62137-1-4 | EN-Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test | |
| BSI BS EN 62137-1-5 | EN-Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test | |
| BSI BS EN 62341-1-1 | EN-Organic light emitting diode (OLED) displays - Part 1-1: Generic specifications-CORR: June 30 2010 | |
| BSI BS EN 62341-1-2 | EN-Organic light emitting diode displays - Part 1-2: Terminology and letter symbols | |
| BSI BS EN 62341-5 | EN-Organic Light Emitting Diode (OLED) displays - Part 5: Environmental testing methods | |
| BSI BS EN 62415 | EN-Semiconductor devices - Constant current electromigration test | |
| BSI BS EN 62416 | EN-Semiconductor devices - Hot carrier test on MOS transistors | |
| BSI BS EN 62417 | EN-Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) | |
| BSI BS EN 62418 | EN-Semiconductor devices - Metallization stress void test | |
| BSI BS EN 62433-2 | EN-EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) | |
| BSI BS EN 62496-1 | EN-Optical circuit boards - Part 1: General | |
| BSI BS EN 62496-3-1 | EN-Optical circuit boards - Performance standard Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres | |
| BSI BS EN 62576 | EN-Electric double-layer capacitors for use in hybrid electric vehicles - Test methods for electrical characteristics | |
| BSI BS EN ISO 21351 | EN-Space systems Functional and technical specifications | |
| BSI BS EN ISO 9969 | EN-Thermoplastics pipes - Determination of ring stiffness | |
| BSI BS IEC 60747-1 + A1 | EN-Semiconductor devices - Part 1: General-CORR 16573: August 31 2006; CORR: June 30 2009; AMD: July 31 2010 | |
| BSI BS IEC 60747-14-1 | EN-Semiconductor devices Part 14-1: Semiconductor sensors - Generic specification for sensors | |
| BSI BS IEC 60747-14-3 | EN-Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors | |
| BSI BS IEC 60747-14-5 | EN-Semiconductor devices Part 14-5: Semiconductor sensors PN-junction semiconductor temperature sensor | |
| BSI BS IEC 60874-10-1 | EN-Connectors for optical fibres and cables - Part 10-1: Detail specification for fibre optic connector type BFOC/25 terminated to multimode fibre type A1 | |
| BSI BS IEC 60874-10-2 | EN-Connectors for optical fibres and cables - Part 10-2: Detail specification for fibre optic connector type BFOC/25 terminated to single-mode fibre type B1 | |
| BSI BS IEC 60874-10-3 | EN-Connectors for optical fibres and cables - Part 10-3: Detail specification for fibre optic adaptor type BFOC/25 for single and multimode fibre | |
| BSI BS IEC 60874-14-1 | EN-Connectors for optical fibres and cables - Part 14-1: Detail specification for fibre optic connector type SC-PC standard terminated to multimode fibre type A1a A1b | |
| BSI BS IEC 60874-14-3 | EN-Connectors for optical fibres and cables - Part 14-3: Detail specification for fibre optic adaptor (simplex) type SC for single-mode fibre | |
| BSI BS IEC 60874-14-4 | EN-Connectors for optical fibres and cables - Part 14-4: Detail specification for fibre optic adaptor (simplex) type SC for multimode fibre | |
| BSI BS IEC 60874-14-5 | EN-Connectors for optical fibres and cables - Part 14-5: Detail specification for fibre optic connector type SC-PC untuned terminated to single-mode fibre type B1 | |
| BSI BS ISO 14954 | EN-Space systems - Dynamic and static analysis - Exchange of mathematical models | |
| BSI BS ISO 15396 | EN-Space data and information transfer systems - Cross support reference model - Space link extension services | |
| BSI BS ISO 16004 | EN-Aircraft ground equipment Passenger boarding bridge or transfer vehicle Requirements for interface with aircraft doors | |
| BSI BS ISO 16031-1 | EN-Aerospace fluid systems - O-rings inch series: Inside diameters and cross sections tolerances and size-identification codes - Part 1: Close tolerances for hydraulic systems | |
| BSI BS ISO 16031-2 | EN-Aerospace fluid systems - O-rings inch series: Inside diameters and cross sections tolerances and size-identification codes - Part 2: Standard tolerances for non-hydraulic systems | |
| BSI BS ISO 22072 | EN-Electrohydrostatic actuator (EHA) Characteristics to be defined in procurement specifications |