BSI - Electronic Components of Assessed Quality Collection
This collection contains documents from the following standards organization(s): British Standards Institution
| BSI BS CECC 22110 | EN-Radio Frequency Coaxial Connectors Series SMA: Sectional Specification | |
| BSI BS CECC 22111 | EN-Specification for Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification Radio Frequency Coaxial Connectors Series SMA | |
| BSI BS CECC 22121 | EN-Specification for Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification Radio Frequency Coaxial Connectors Series BNC | |
| BSI BS CECC 23100-003 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Single and Double Sided Printed Boards with Plain Holes-AMD 9805; February 1998; | |
| BSI BS CECC 23100-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Single and Double-Sided Printed Boards with Plain Holes-Supersedes BS EN 123100-800: 1992; | |
| BSI BS CECC 23200-003 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Single and Double Sided Printed Boards with Plated Through Holes-AMD 9806; February 1998; | |
| BSI BS CECC 23200-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Single and Double-Sided Printed Boards with Plated Through Holes-Supersedes BS EN 123200-800: 1992; | |
| BSI BS CECC 23300-003 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Multilayer Printed Boards-AMD 9807; February 1998 | |
| BSI BS CECC 23300-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Multi-Layer Printed Boards-Supersedes BS EN 123300-800: 1992; | |
| BSI BS CECC 23600-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Flex-Rigid Multilayer Printed Boards with Through Connections | |
| BSI BS CECC 23700-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Flex-Rigid Double-Sided Printed Boards with Through Connections | |
| BSI BS CECC 23800-801 | EN-Harmonized System of Quality Assessment for Electronic Components Capability Detail Specification: Flexible Multilayer Printed Boards with Through Connections | |
| BSI BS CECC 25300 | EN-Magnetic Oxide Cores for Power Applications: Sectional Specification-Amd 1:September 301982 | |
| BSI BS CECC 265001 | EN-Harmonized System of Quality Assessment for Electronic Components Technology Approval Schedule: Film and Hybrid Integrated Circuits | |
| BSI BS CECC 299 001 | EN-Technology Approval Schedule - Manufacture of Electrical Connectors-CECC 299 001:1999; | |
| BSI BS CECC 30201 001 | EN-Tantalum Capacitors with Solid Electrolyte Porous Anode Metal Case: Detail Specification: Basic Plus Additional | |
| BSI BS CECC 30202 | EN-Tantalum Capacitors with Non-Solid Electrolyte Porous Anode: Blank Detail Specification-Superseded by BS EN 130202: 1998 | |
| BSI BS CECC 30300 | EN-Sectional Specification: Aluminium Electrolytic Capacitors with Solid and Non-Solid Electrolyte-Superseded by BS EN 130300: 1998 | |
| BSI BS CECC 30301 024 | EN-Aluminium Electrolytic Capacitors with Non- Solid Electrolyte. Long- Life Grade: Detail Specification: Full Plus Additional Assessment Level-Amd 1:March 311982 | |
| BSI BS CECC 30401 | EN-Fixed Metallized Polyethylene Terephthalate Film Dielectric d.c. Capacitors: Blank Detail Specification | |
| BSI BS CECC 30401 023 | EN-Fixed Metallized Polyethylene Terephthalate Film d.c. Dielectric Capacitors Rectangular Non- Metallic Case: Detail Specification: Full Assessment-Amd 1:September 301982 | |
| BSI BS CECC 30401 033 | EN-Fixed Metallized Polyethylene Terephthalate Film Dielectric d.c. Capacitors Rectangular Non-Metallic Case: Detail Specification: Full Assessment | |
| BSI BS CECC 30500 | EN-Fixed Metallized Polycarbonate Film Dielectric Capacitors for Direct Current-Superseded by BS EN 130500: 1998; Supersedes BS 9070: SEC 6: 1971 | |
| BSI BS CECC 30501 | EN-Blank Detail Specification Fixed Metallized Polycarbonate Film Dielectric Capacitors for Direct Current-Superseded by BS EN 130501: 1998 | |
| BSI BS CECC 31201 | EN-Fixed Capacitors with Metallized Electrodes and Polypropylene Dielectric: Blank Detail Specification-Amd 1:March 301984 | |
| BSI BS CECC 40101 019 | EN-Fixed Low Power Non- Wirewound Resistors Insulated. Typical Construction: Metal Oxide Film Helically Cut: Detail Specification: Full Assessment Level | |
| BSI BS CECC 40300 | EN-Fixed Precision Resistors: Sectional Specification | |
| BSI BS CECC 40301 | EN-Fixed Precision Resistors: Blank Detail Specification | |
| BSI BS CECC 40302 | EN-Fixed Precision Resistors (Assessment Level F) Blank Detail Specification | |
| BSI BS CECC 41100 | EN-Lead Screw Actuated and Rotary Preset Potentiometers: Sectional Specification-Amd 1:December 231987 | |
| BSI BS CECC 41101 | EN-Specification for Harmonized system of quality assessment for electronic components - Blank detail specification - Preset potentiometers (Assessment level S) | |
| BSI BS CECC 41101-007 | EN-Harmonized blank detail specification for lead screw actuated non-wirewound preset potentiometers - Square form container sealed actuating device insulated from resistive element slipping clutch at each end of t | |
| BSI BS CECC 41102 | EN-Preset Potentiometers: Blank Detail Specification: Assessment Level M | |
| BSI BS CECC 41200 | EN-Power Potentiometers: Sectional Specification | |
| BSI BS CECC 41201 | EN-Specification for harmonized system of quality assessment for electronic components. Blank detail specification: power potentiometers (assessment level S) | |
| BSI BS CECC 41202 | EN-Specification for harmonized system of quality assessment for electronic components. Blank detail specification: power potentiometers (assessment level M) | |
| BSI BS CECC 41300 | EN-Low Power Single-Turn Rotary Potentiometers: Sectional Specification | |
| BSI BS CECC 41301 | EN-Low Power Single Turn Rotary Potentiometers: (Assessment Level S): Blank Detail Specification (In Accordance with BS CECC 41300) (T) | |
| BSI BS CECC 41302 | EN-Low Power Single Turn Rotary Potentiometers: (Assessment Level M): Blank Detail Specification (In Accordance with BS CECC 41300) (T) | |
| BSI BS CECC 41400 | EN-Rotary Precision Potentiometers: Sectional Specification-Amd 1:December 301983 | |
| BSI BS CECC 41401 | EN-Specification for harmonized system of quality assessment for electronic components. Blank detail specification: rotary precision potentiometers (assessment level S) | |
| BSI BS CECC 42100 | EN-Low Voltage Varistors Primarily for Telephony Applications: Sectional Specification-Amd 1:May 311982 | |
| BSI BS CECC 42101 | EN-Low Voltage Varistors Primarily for Telephony Applications (Assessment Level P): Blank Detail Specification | |
| BSI BS CECC 42200 | EN-Surge Suppression Varistors | |
| BSI BS CECC 42201 | EN-Surge Suppression Varistors: Blank Detail Specification | |
| BSI BS CECC 45000 | EN-Specification for Harmonized system of quality assessment for electronic components: Generic specification: Space-charge controlled tubes | |
| BSI BS CECC 45004 | EN-Specification for Harmonized system of quality assessment for electronic components - Blank detail specification - Disc seal power tubes | |
| BSI BS CECC 46000 | EN-Harmonized system of quality assessment for electronic components - Generic specification: Cold cathode indicator tubes | |
| BSI BS CECC 46001 | EN-Specification for Harmonized system of quality assessment for electronic components - Blank detail specification - Cold cathode indicator tubes | |
| BSI BS CECC 50000 | EN-Harmonized system of quality assessment for electronic components Generic specification: Discrete semiconductor devices-AMD 7012: October 1992; | |
| BSI BS CECC 50000 SUPP 1 | EN-Harmonized System of Quality Assessment for Electronic Components Generic Specification: Discrete Semiconductor Devices Supplement No. 1: CECC Assessed Process Average | |
| BSI BS CECC 50008 | EN-Ambient-Rated Rectifier Diodes-Remains Current | |
| BSI BS CECC 50009 | EN-Case-Rated Rectifier Diodes-Remains Current | |
| BSI BS CECC 51001 | EN-Specification for Harmonized system of quality assessment for electronic components - Blank detail specification - Mercury wetted change-over contact units magnetically biased | |
| BSI BS CECC 63000 | EN-Harmonized system of quality assessment for electronic components: Generic specification: Film and hybrid integrated circuits | |
| BSI BS CECC 63100 | EN-Harmonized System of Quality Assessment for Electronic Components: Sectional Specification: Film and Hybrid Integrated Circuits-AMD 6135: April 1991; AMD 6620: April 1991; AMD 6621: April 1991 | |
| BSI BS CECC 63101 | EN-Specification for Harmonized system of quality assessment for electronic components - Blank detail specification: film and hybrid integrated circuits-AMD 6595: July 1990 | |
| BSI BS CECC 63200 | EN-Harmonized System of Quality Assessment for Electronic Components: Sectional Specification: Film and Hybrid Integrated Circuits (Capability Approval)-AMD 5491: September 1987; AMD 6134: April 1991; AMD 6622: April 19 | |
| BSI BS CECC 63201 | EN-Specification for Harmonized system of quality assessment for electronic components - Blank detail specification - Film and hybrid integrated circuits - (Capability approval)-AMD 5733: August 1987; AMD 6583: Ju | |
| BSI BS CECC 68100 | EN-Harmonized System of Quality Assessment for Electronic Components: Sectional Specification: Quartz Crystal Units (Capability Approval) | |
| BSI BS CECC 75100 | EN-Harmonized system of quality assessment for electronic components Sectional specification: Two-part and edge socket connectors for printed board application-AMD 7806: June 1993 | |
| BSI BS CECC 75101 | EN-Two-Part and Edge Socket Connectors for Printed Board Application: Example Detail Specification/ Blank Detail Specification | |
| BSI BS CECC 75201 | EN-Blank Detail Specification Interim Example Detail Specification/Blank Detail Specification Circular Connectors for Frequencies Below 3 MHz | |
| BSI BS CECC 75301 | EN-Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Interim Example. Detail specification/blank detail specification: rectangular connectors for frequencie | |
| BSI BS CECC 90000 | EN-Harmonized system of quality assessment for electronic components Generic specification: Monolithic integrated circuits-AMD 7386: January 1993 | |
| BSI BS CECC 90000 ADD 1 | EN-Generic Specification: Monolithic Integrated Circuits Addendum 1: Internal Visual Inspection (AMD 5923) February 28 1990 (T)-Amd 4; | |
| BSI BS CECC 90104 | EN-Specification for Harmonized system of quality assessment for electronic components Family specification C. MOS digital integrated circuits Series 4000 B and 4000 UB-Amd 8290: August 15 1994 | |
| BSI BS CECC 90105 | EN-Blank Detail Specification: Fusible Link Programmable Bipolar Read Only Memories Silicon Monolithic Integrated Circuits (AMD 8163) March 15 1993 (T)-Amd 2; | |
| BSI BS CECC 90109 | EN-Specification for Harmonized system of quality assessment for electronic comonents Family Specification Digital integrated HC MOS circuits series HC/HCT/HCU-"REMAINS CURRENT" | |
| BSI BS CECC 90111 | EN-Blank Detail Specification: MOS Read/Write Static Memories Silicon Monolithic Circuits (AMD 8164) March 15 1994 (T)-Amd 1; | |
| BSI BS CECC 90112 | EN-Blank Detail Specification: MOS Read/Write Dynamic Memories Silicon Monolithic Circuits (AMD 8165) March 15 1994 (T)-Amd 1; | |
| BSI BS CECC 90113 | EN-MOS Ultra-Violet Light Erasable Electrically Programmable Read Only Memories Silicon Monolithic Circuits (AMD 5997) November 30 1990-Amd 1; | |
| BSI BS CECC 90114 | EN-Blank Detail Specification: Programmable Logic Arrays (PLA) (AMD 8166) March 15 1994 (T)-Amd 1; | |
| BSI BS CECC 90115 | EN-Harmonized System of Quality Assessment for Electronic Components Blank Detail Specification Digital Array Integrated Circuits (T) | |
| BSI BS CECC 90200 | EN-Harmonized System of Quality Assessment for Electronic Components: Sectional Specification: Analogue Monolithic Integrated Circuits-AMD 8292: August 15 1994 | |
| BSI BS CECC 90201 | EN-AMD 1 Blank Detail Specification: Integrated Voltage Regulators (AMD 8291) August 15 1994 (T) | |
| BSI BS CECC 90202 | EN-Blank Detail Specification: Integrated Operational Amplifiers-AMD 8293 August 15 1994; Replaces BS CECC 90202: 1985; | |
| BSI BS CECC 90203 | EN-Integrated Analogue Switching Circuits: Blank Detail Specification | |
| BSI BS CECC 90300 | EN-Sectional Specification: Interface Monolithic Integrated Circuits (Read in Conjunction with BS CECC 90000) (T)-Amd 1:August 151994 |