BSI - Electronic Components of Assessed Quality Collection
This collection contains documents from the following standards organization(s): British Standards Institution
| BSI BS 9300 C771-772 | EN-Electronic parts of assessed quality - Coaxial mixer diodes | |
| BSI BS 9300 C776-777 | EN-Electronic parts of assessed quality - germanium coaxial mixed diodes | |
| BSI BS 9300 C778 | EN-Electronic parts of assessed quality - Matched pair of germanium coaxial mixer diodes | |
| BSI BS 9300 C780-831 | EN-Electronic parts of assessed quality - Silicon voltage regulator diode | |
| BSI BS 9300 C841-849 | EN-Electronic parts of assessed quality - Silicon voltage regulator diode | |
| BSI BS 9301 N002 | EN-Detail specification for General purpose silicon signal diodes - 150 mA 150 V hermetically sealed glass encapsulation - General application category Q | |
| BSI BS 9305 N001 | EN-Detail specification for silicon voltage regulator diodes - 1.5 W 3.3 to 33 V (5 %) hermetically sealed - General application category Q | |
| BSI BS 9305 N041 | EN-Detail specification for silicon voltage regulator diodes - 400 mW 2.7 to 33 V (5 %) hermetically sealed glass encapsulation - General application category Q | |
| BSI BS 9305 N042 | EN-Detail specification for silicon voltage regulator diodes - 1.5 W 6.8 to 200 V (5 %) hermetically sealed - General application category C | |
| BSI BS 9305 N044 | EN-Detail specification for silicon voltage regulator diodes - 1.0 W 3.3 to 33 V (5 %) hermetically scaled - Full assessment level | |
| BSI BS 9364 N007 & N009 | EN-Detail specification for low power silicon n-p-n switching transistors - 20 V planar epitaxial ambient rated hermetic encapsulation - Full plus additional assessment level-AMD 3317: October 1980 | |
| BSI BS 9364 N008 & N010 | EN-Detail Specification for Low Power N-P-N 20 V 300 mW Switching Transistor of Assessed Quality Ambient Rated Hermetic Encapsulation | |
| BSI BS 9364 N011 | EN-Detail specification for low power silicon p-n-p switching transistors - 65 V planer epitaxial ambient rated hermetic encapsulation - Full plus additional assessment level-AMD 3581: April 1981 | |
| BSI BS 9364 N012 | EN-Detail specification for low power silicon p-n-p switching transistors - 65 V planar epitaxial ambient rated hermetic encapsulation (long lead version) - Full plus additional assessment level | |
| BSI BS 9364 N013 | EN-Detail specification for low power silicon p-n-p switching transistors - 25 V planar epitaxial ambient rated hermetic encapsulation - Full plus additional assessment level-AMD 3185: October 1979 | |
| BSI BS 9364 N016 | EN-Detail specification for low power silicon n-p-n switching transistors - 65 V planar epitaxial ambient rated hermetic encapsulation - Full plus additional assessment level-AMD 3186: October 1979 | |
| BSI BS 9364 N017 | EN-Detail specification for low power silicon n-p-n switching transistors - 65 V planar epitaxial ambient rated hermetic encapsulation (long lead version) - Full plus additional assessment level-AMD 3187: October | |
| BSI BS 9450 | EN-Specification for Integrated Electronic Circuits and Micro-Assemblies of Assessed Quality (Capability Approval Procedures): Generic Data and Methods of Test-CORR 10184; September 1998 | |
| BSI BS 9520 | EN-Specification for Electrical Connectors of Assessed Quality for d.c. and Low Frequency Application: Generic Data Methods of Test and Capability Approval Procedures-AMD 4817: April 1985; AMD 5681: November 1987; AMD | |
| BSI BS 9522 | EN-Rules for the preparation of detail specifications for - Circular electrical connectors of assessed quality for d.c. and low frequency applications. Full basic and full plus airframe assessment levels | |
| BSI BS 9522 N0001 | EN-Detail specification for Multi-contact circular electrical connectors for d.c. and low frequency applications - Bayonet coupling with front release rear removable crimp contacts - Full assessment level-AMD 6821: | |
| BSI BS 9522 N0003 | EN-Detail specification for Multi-contact circular electrical connectors for d.c. and low frequency applications - Bayonet coupling non-barrier sealed environment resistant with rear insertable rear release rear re | |
| BSI BS 9523 | EN-Rules for the Preparation of Detail Specifications for Rectangular Electrical Connectors of Assessed Quality with Integral Metal Housings for d.c. and Low Frequency Applications - Full and Basic Assessment Levels-AMD | |
| BSI BS 9524 | EN-Rules for the Preparation of Detail Specifications for Rectangular Electrical Connectors of Assessed Quality with Moulded Bodies for d.c. and Low Frequency Applications - Full and Basic Assessment Levels-AMD 4748: No | |
| BSI BS 9525 | EN-Rules for the Preparation of Detail Specifications for Two- Part Printed Board Electrical Connectors and Board-Mounted Transition Devices of Assessed Quality for D.C. and L.F. Applications: Full and Basic Assessment | |
| BSI BS 9525 N0001 | EN-Detail specification for multi-contact two-part printed board electrical connectors-AMD 4276: May 1983; AMD 6856: June 1992 | |
| BSI BS 9612 N004 | EN-Detail specification for cold welded seal quartz crystal units for oscillator applications - DN 47 U/2 DQ and DP enclosures 0.8 to 20 MHz and 3.0 to 30 MHz frequency ranges - Fundamental thickness-shear mode AT-c | |
| BSI BS 9612 N005 | EN-Detail specification for cold welded seal quartz crystal units for oscillator applications - DN DQ and DP enclosures 0.8 to 20 MHz and 3.0 to 30 MHz frequency ranges - Fundamental thickness-shear mode AT-cut fo | |
| BSI BS 9612 N006 | EN-Detail specification for cold welded seal quartz crystal units for oscillator applications - DN 47 U/2 DQ and DP enclosures 17 to 75 MHz frequency range - Third overtone thickness-shear mode At-cut for operation | |
| BSI BS 9612 N009 | EN-Detail specification for cold welded seal quartz crystal units for oscillator applications - DN DQ and DP enclosures 50 to 125 MHz frequency range - Fifth overtone thickness-shear mode AT-cut for operation ov | |
| BSI BS 9612 N010 | EN-Detail specification for cold welded seal quartz crystal units for oscillator applications - DK enclosure 6.0 to 25 MHz frequency range - Fundamental thickness-shear mode AT-cut for operation over wide tempera | |
| BSI BS 9612 N016 | EN-Detail specification for resistance welded seal quartz crystal units for oscillator applications - DN DZ DQ and DP enclosures 0.8 to 20 MHz and 3.0 to 30 MHz frequency ranges - Fundamental thickness-shear mode | |
| BSI BS 9612 N017 | EN-Detail specification for resistance welded seal quartz crystal units for oscillator applications - DN DZ DQ and DP enclosures 0.8 to 20 MHz and 3.0 to 30 MHz frequency ranges - Fundamental thickness-shear mode | |
| BSI BS 9612 N018 | EN-Detail Specification for Resistance Welded Quartz Crystal Units for Oscillator Applications. Frequecy Range 17 to 75 MHz Wide Temperature Range | |
| BSI BS 9612 N019 | EN-Detail specification for resistance welded seal quartz crystal units for oscillator applications - DN DZ DQ and DP enclosures 17 to 75 MHz frequency range - Third overtone thickness-shear mode AT-cut for ope | |
| BSI BS 9612 N020 | EN-Detail specification for resistance welded seal quartz crystal units for oscillator applications - DN DZ DQ and DP enclosures 50 to 125 MHz frequency range - Fifth overtone thickness-shear mode AT-cut for op | |
| BSI BS 9612 N021 | EN-Detail specification for resistance welded seal quartz crystal units for oscillator applications - DN DZ DQ and DP enclosures 50 to 125 MHz frequency range - Fifth overtone thickness-shear mode AT-cut for op | |
| BSI BS 9617 | EN-Rules for the preparation of Detail specifications for Quartz crystal units of assessed quality - Full assessment level | |
| BSI BS 9620 | EN-Specification for Quartz crystal oscillators of assessed quality: Generic data and methods of test-AMD 3997: December 31 1982; AMD 4613: August 30 1985 | |
| BSI BS 9625 | EN-Blank detail specification for - Quartz crystal oscillators of assessed quality - Full assessment level | |
| BSI BS 9720 | EN-Specification for Custom-built transformers and inductors of assessed quality: generic data and methods of test-AMD 6348: September 1991 | |
| BSI BS 9721 | EN-Sectional Specification for Signal Transformers of Assessed Quality for Use in Electronic Equipment for Capability Approval-: 1978 | |
| BSI BS 9727 | EN-Sectional Specification for Power Transformers of Assessed Quality for Use in Electronic Equipment. Basic Assessment Level | |
| BSI BS 9733 | EN-Sectional Specification for Pulse Transformers of Assessed Quality for Use in Electronic Equipment. Basic Assessment Level | |
| BSI BS 9734 | EN-Sectional Specification for Pulse Transformers of Assessed Quality for Use in Electronic Equipment: Full Assessment Level (T) | |
| BSI BS 9741 | EN-Sectional Specification for Inductors of Assessed Quality for Use in Electronic Equipment for Capability Approval | |
| BSI BS 9751 | EN-Blank Detail Specification for Fixed Insulated (Unshielded) r.f. Inductors at the Full Assessment-AMD 3773 November AMD 3773: November 1981; AMD 5588: February 27 1987 | |
| BSI BS 9751 N0001 | EN-Detail specification for fixed insulated (unshielded) radio frequency inductors Wire wound on ferrite iron dust or phenolic cylindrical former Full assessment level | |
| BSI BS 9753 | EN-Sectional Specification for Variable r.f. Type Inductors of Assessed Quality for Use in Electronic Equipment for Capability Approval-Amd 1; | |
| BSI BS 9925-0 | EN-Inductor and Transformer Cores for Telecommunications Part 0: Generic Specification | |
| BSI BS 9925-01.0 | EN-Inductor and Transformer Cores for Telecommunications Part 01.0: Magnetic Oxide Cores in Inductor Applications | |
| BSI BS 9925-01.01 | EN-Inductors and Transformer Cores for Telecommunications Part 01.01: Magnetic Oxide Cores for Inductor Applications: Blank Detail Specification: Assessment Level A | |
| BSI BS 9925-02.0 | EN-Inductor and Transformer Cores for Telecommunications Part 02.0: Magnetic Oxide Cores for Broad- Band Transformers: Sectional Specification | |
| BSI BS 9925-02.01 & 02.02 | EN-Inductor and Transformer Cores for Telecommunications Part 02.01 and Part 02.02: Magnetic Oxide Cores for Broad Band Transformers Assessment Levels A and B: Blank Detail Specification | |
| BSI BS 9925-03.0 | EN-Inductor and Transformer Cores for Telecommunications Part 03.0: Magnetic Oxide Cores for Transformers and Chokes for Power Applications | |
| BSI BS 9925-03.01 | EN-Inductor and Transformer Cores for Telecommunications Part 03.01: Magnetic Oxide Cores for Transformers and Chokes for Power Applications. Assessment Level A | |
| BSI BS 9940-01.0 | EN-Harmonized system of quality assessment for electronic components Fixed resistors for use in electronic equipment Part 01.0: Sectional specification: Fixed low power non-wirewound resistors-IEC 115-2: 1982; QC 4001 | |
| BSI BS 9940-01.01 | EN-Fixed Resistors for Use in Electronic Equipment Part 01.01: Fixed Resistors for Use Electronic Equipment Fixed Low Power Non-Wirewound Resistors Assessment Level E | |
| BSI BS 9940-03.0 | EN-Fixed Resistors for Use In Electronic Equipment Part 03.0: Sectional Specification: Fixed Precision Resistors | |
| BSI BS 9940-03.01 | EN-Fixed Resistors For Use in Electronic Equipment Part 03.01: Fixed Precision Resistors: Blank Detail Specification: Assessment Level E | |
| BSI BS 9940-04.0 | EN-Fixed Resistors for Use in Electronic Equipment Part 04.0: Fixed Resistor Networks with Individually Measurable Resistors: Sectional Specification (AMD 5916) September 29 1989-Amd 1; | |
| BSI BS 9940-04.01 | EN-Fixed Resistors for Use in Electronic Equipment Part 04.1: Fixed Resistor Networks with Individually Measurable Resistors All of Equal Value and Equal Dissipation: Blank Detail Specification: Assessment Level E | |
| BSI BS 9940-04.02 | EN-Fixed Resistors for Use in Electronic Equipment Part 04.2: Fixed Resistor Networks with Individually Measurable Resistors of Either Different Resistance Values or Different Rated Dissipators: Blank Detail Spec. Asses | |
| BSI BS 9940-05.00 | EN-Fixed Resistors for Use in Electronic Equipment Part 05.00: Fixed Resistor Networks in Which Not All Resistors Are Individually Measurable: Sectional Specification | |
| BSI BS 9940-05.01 | EN-Fixed Resistors for Use in Electronic Equipment Part 05.01: Fixed Resistor Networks in Which Not All Resistors Are Individually Measurable: Blank Detail Specification: Assessment Level E | |
| BSI BS CECC 00009 | EN-Harmonized system of quality assessment for electronic components Basic specification: Basic testing procedures and measuring methods for electromechanical components | |
| BSI BS CECC 00016 | EN-Basic Specification: Basic Requirements for the Use of Statistical Process Control (SPC) in the CECC System (T) | |
| BSI BS CECC 00108 | EN-Rule of Procedure 8 Attestation of Conformity the CECC Mark and Conditions of Use Certificates of Approval and Procedures for the Attestation of Conformity | |
| BSI BS CECC 00111-0 | EN-Rule of Procedure 11 Specifications Part 0: an Introduction to the Types of Specifications Applicable Within the CECC System (T) | |
| BSI BS CECC 00804 | EN-Harmonized System of Quality Assessment for Electronic Components Interpretation of 'EN ISO 9000: 1994' Reliability Aspects for Electronic Components (T) | |
| BSI BS CECC 00808 | EN-Harmonized System of Quality Assessment for Electronic Components Guidance Document: Use and Application of Plastic Encapsulated Devices (T) | |
| BSI BS CECC 123400-003 | EN-Harmonized System of Quality Assessment for Electronic Components: Capability Detail Specification: Flexible Printed Boards Without Through-Connections-AMD 9198 December 151996; | |
| BSI BS CECC 123500-003 | EN-Harmonized System of Quality Assessment for Electronic Components: Capability Detail Specification: Flexible Printed Boards with Through-Connections-AMD 9208; December 15 1996; | |
| BSI BS CECC 16000-1 | EN-Harmonized system of quality assessment for electronic components: Generic specification: Electromechanical all-or-nothing relays Part 1: General | |
| BSI BS CECC 16100 | EN-Harmonized system of quality assessment for electronic components - Sectional specification: Electromechanical all-or-nothing relays | |
| BSI BS CECC 16101 | EN-Specification for Harmonized system of quality assessment for electronic components - Blank detail specification - Electromechanical all-or-nothing relays - Test schedule 3 | |
| BSI BS CECC 17001 | EN-Specification for Harmonized system of quality assessment for electronic components - Blank detail specification - Mercury wetted make contact units for general application | |
| BSI BS CECC 20000 | EN-Harmonized system of quality assessment for electronic components: Generic specification: Semiconductor optoelectronic and liquid crystal devices-AMD 4606: October 1984; AMD 5800: February 1989 | |
| BSI BS CECC 200025 | EN-Harmonized System of Quality Assessment for Electronic Components; Process Assessment Schedule: Printed Board Assembly Facilities |