ASTM Int'l to Develop Proposed Tin-Based Solder Alloys Standard - ASTM WK15434
October 19, 2007 // Published as a news service by IHS
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Electronics & Telecom Standards Collections IEEE Standards News Electronics & Telecom StandardsThe analytical requirements for solder manufacturers became more challenging with the introduction of Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) legislation that governs the use of hazardous substances in electrical and electronic equipment, according to Dirk Wissmann, product manager, Spectro Analytical Instruments and Committee F40 member.
"For example, with the introduction of RoHS, new types of solder were developed that do not contain lead, cadmium and mercury above any regulated level," said Wissmann.
"To get comparable analysis results in different labs with different instrumentation, it is always best to describe the analytical procedure in as much detail as possible."
Wissmann said that producers and users of tin-based solder alloys will be able to use the proposed standard to check base material for compliance as well as to monitor the solder bath for contamination and other changes during longer periods of use.
The subcommittee would like to have more manufacturers of tin-based solder material involved in the standards developing process.
The proposed standard is being developed by Subcommittee F40.01 on Test Methods, which is part of ASTM International Committee F40 on Declarable Substances in Materials.
Source: ASTM International.